LCD non-touch

LCD, non-touch: The CDE series now comes in three versions, all visually identical, but are available in three levels:

LCD Touch

LCD Touch: The IFP series will continue, but completely new software will be released in the fall, which will be even faster to customize and offer even more features.

LED

LED: In addition to GOB (glue on board) and COB (chip on board), there is now MIP technology: We see a smoother image, a pitch of 0.3 is now possible, and the efficiency is much greater: unlike previous versions, the screen hardly gets warm, and therefore consumes much less power.

ViewSonic's MIP LED technology, also known as Micro LED in Package, is an advanced packaging technology that combines RGB diodes smaller than 100 microns into a surface-mount diode (SMD). This technology offers several advantages over traditional LED packaging methods such as COB (chip on board) and SMD (surface mount device).

Here are some key features and benefits of MIP LED technology:

High Brightness: MIP LED displays can achieve higher brightness levels compared to COB, with products capable of delivering brightness levels of up to 4,000 nits.

Pixel Adaptivity: MIP technology enables a single package to adapt for different pixel pitches, ranging from P0.5 to P2.5.

Repairability: Unlike COB technology, which often requires complete module replacement for defective pixels, MIP technology offers greater repairability.

Energy Efficiency: MIP LED displays consume less power and offer improved efficiency, making them both visually appealing and environmentally friendly.

Durability: The diodes are encapsulated in resin, which increases durability and helps with heat dissipation.

MIP LED technology is often used in applications where high resolution, brightness and durability are crucial, such as indoor LED walls, stage displays, corporate meeting rooms and even outdoor digital kiosks